Risultati di ricerca
The crater grinding wear test (DIN EN 1071-6, EN ISO 26423) The crater grinding method can be used to precisely determine the wear resistance of coatings and surfaces. A steel ball wetted with an abrasive fluid and rotating against the specimen grinds a crater into the layer to be tested. The wear coefficient can be calculated from the volume ...
1 ott 2023 · Therefore, after wet grinding for 10 min, the film opacity decreased to 1.15 A/mm, the water vapor permeability decreased to 3.45 × 10 −9 ·g·m·m −2 ·s −1 ·Pa, the contact angle increased from 56.48° to 72.37°, the tensile strength increased from 1.20 MPa to 2.72 MPa, the elongation at break increased from 74.9% to 166.8%, and the surface of the film was uniform and dense.
The outstanding hardness and wear resistance of diamond materials pose significant challenges in their grinding processes for semiconductor substrate materials. To overcome this, a mechanochemical effect-based approach is used, which employs a grinding wheel comprising titanium (Ti)-coated diamond abrasives. A uniform Ti coating is vacuum-evaporated onto micrometer-scale diamond abrasives. The ...
20 giu 2023 · 2.1 Formation mechanism of the electrolytic oxide film of a cast-iron-bonded grinding wheel. According to research by Wu [], in the early stage of the electrolysis of a cast-iron-bonded grinding wheel, the reaction intermediates of oxide film, Fe (OH) 3, and Fe (OH) 2 are formed by the combination of iron ions on the surface of the cast-iron-bonded grinding wheel with hydroxide ions in the ...
The Berlin Wall came down." Thought the word communism isn't used anymore, this film will show the ideas behind it are alive and well. Join Bowers for a fascinating look at the people and groups that have successfully targeted America's morality and freedom in their effort to grind America down. It's a well documented AGENDA.
3 ago 2023 · This resin composition for a back grinding film substrate contains at least one type selected from among an ethylene·unsaturated ester copolymer (A), an ethylene·α-olefin copolymer (B) having a melt flow rate, as measured at a temperature of 190ºC and a load of 2160 g, of not less than 0.1 g/10 min and less than 25 g/10 min, and a styrenic resin (C).
11 lug 2023 · Adhesive mounting involves the use of a thin layer of adhesive film, typically made of UV-curable or heat-sensitive materials, to attach the wafer to a support substrate, an example is lamination. Lamination refers specifically to the process of attaching a temporary carrier substrate to the backside of the wafer using an adhesive material.
